Spatial Spirals" 2009
Spatial Spirals" 2009
Still sounds nerve-wracking to me Just for completeness, what brand/type of epoxy do you use? I expect some epoxies will be better than others as far as viscosity and bubbles go. I'm assuming a 2-part epoxy. Maybe a single component (heat cured) epoxy would work too, without destroying the hologram? Or maybe nowadays there are good UV activated resins less expensive than Norland...
Spatial Spirals" 2009
while it is a big pain in it a** to apply, the benefits in the end are well worth it! this is the stuff im currently using
http://www.michaels.com/online/product/ ... gc0509.jpg
the speed of the cure is regulated by the amount of catalyst used. i never liked the UV curing stuff, due how thick (like syrup) and the toxic odor........
http://www.michaels.com/online/product/ ... gc0509.jpg
the speed of the cure is regulated by the amount of catalyst used. i never liked the UV curing stuff, due how thick (like syrup) and the toxic odor........
Spatial Spirals" 2009
Dave I haven't been to a computer lately that allowed me to see this video clip. This is dammed impresive! Truely a work of art.
Thanks for sharing with us.
Thanks for sharing with us.
Spatial Spirals" 2009
Dave do you use this stuff on DCG as well? Can it be used to sandwich two pieces of glass or used with glass to plastic.dave battin wrote:while it is a big pain in it a** to apply, the benefits in the end are well worth it! this is the stuff im currently using
http://www.michaels.com/online/product/ ... gc0509.jpg
the speed of the cure is regulated by the amount of catalyst used. i never liked the UV curing stuff, due how thick (like syrup) and the toxic odor........
I had to show some friends this video, they were very impressed. Beautiful work again Dave!
Spatial Spirals" 2009
good question, i'm sealing some dcgs now and will give it a test/try and let you know how it comes outDutchelm05 wrote:Dave do you use this stuff on DCG as well? Can it be used to sandwich two pieces of glass or used with glass to plastic.